- All sections
- B - Performing operations; transporting
- B23K - Soldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beam
- B23K 26/16 - Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
Patent holdings for IPC class B23K 26/16
Total number of patents in this class: 593
10-year publication summary
|
31
|
34
|
51
|
61
|
60
|
36
|
55
|
54
|
63
|
20
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Seurat Technologies, Inc. | 126 |
26 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 585 |
16 |
| Disco Corporation | 1745 |
13 |
| Samsung Display Co., Ltd. | 30585 |
11 |
| Honda Motor Co., Ltd. | 24537 |
11 |
| Velo3D, Inc. | 143 |
11 |
| TOYOKOH, Co., Ltd. | 24 |
9 |
| Hamamatsu Photonics K.K. | 4161 |
8 |
| The Boeing Company | 19843 |
7 |
| Amada Company, Limited | 492 |
7 |
| POSCO | 2222 |
7 |
| Mitsubishi Electric Corporation | 43934 |
6 |
| Komatsu Industries Corporation | 185 |
6 |
| IPG Photonics Corporation | 494 |
6 |
| POSCO Co., Ltd. | 1059 |
6 |
| Tokyo Electron Limited | 11599 |
5 |
| Panasonic Intellectual Property Management Co., Ltd. | 27812 |
5 |
| Amada Holdings Co., Ltd. | 297 |
5 |
| Bystronic Laser AG | 256 |
5 |
| Contemporary Amperex Technology Co., Limited | 5805 |
5 |
| Other owners | 418 |